Search results for: R. Singh
Ieee transactions on components and packaging technologies > 2009 > 32 > 2 > 447 - 452
2006 International Semiconductor Conference > 1 > 175 - 178
Journal of Electronic Materials > 2003 > 32 > 7 > 717-722
Ieee transactions on components and packaging technologies > 2009 > 32 > 2 > 447 - 452
2006 International Semiconductor Conference > 1 > 175 - 178
Journal of Electronic Materials > 2003 > 32 > 7 > 717-722