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A hierarchically structured Cu-Ni-P film fabricated via one-step route of electroless plating is reported. The morphology of deposits can be controlled by adjusting the additive in electrolyte. Due to the synergistic crystalline modification of polyethylene glycol (PEG), Janus Green B (JGB) and Cl−, the as-prepared Cu-Ni-P film exhibits pine-like architecture, about 2 µm in height and 1.5µm in root...
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