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Three-dimensional structure has been achieved using interlayer connecting technology with double-side solder bump and the lifetime of the solder joints under thermal shock test has been forecasted by finite element method. The simulation result presents that the stress at the interface between 0.76mm solder bump and PCB is evidently higher than that in other places. The interface between 0.76mm solder...
Three-dimensional integrated circuits (3D-ICs) packaging has attracted a lots of attentions due to it has advantages of integrating heterogeneous functions among stacked chips. The thermal mismatch stresses with regard to interconnects composed through silicon via (TSV) and microbump induced by thermal cycling loads becomes a serious concern while a thinner stacked die thickness is required. To shrink...
In recent years, the reliability under vibration loading has become a very important problem of modern electronic devices. And existing researches have shown that the results of natural frequencies and modal shapes by FEA (Finite Element Analysis) fit that of modal test well. But it is challengeable to execute the vibration fatigue life analysis rapidly and accurately. In this paper, a predict method...
In recent years, the reliability under vibration loading has become a very important problem of modern electronic devices. And existing researches have shown that the results of natural frequencies and modal shapes by FEA (Finite Element Analysis) fit that of modal test well. But it is challengeable to execute the vibration fatigue life analysis rapidly and accurately. In this paper, a predict method...
LED with many advantages such as high brightness, long-lifetime, and energy-saving has been successfully applied to various fields, especially on special lighting applications. At low temperatures, LED is more uniform in illumination and has a higher luminous efficiency, which is regarded as the next generation refrigeration system lighting. As well as in some cold regions, LED has also become the...
In this study, a 3D package module based on flexible substrate is proposed. In order to improve the thermo-mechanical reliability of the 3D package module, the simulation of the key manufacture process is more and more important. The key manufacture processes of the 3D substrate package module mainly include 2D chip assembly, under-filling, 3D substrate folding, die-attaching, molding, and ball grid...
To have a full description of the fatigue behavior of nano-silver sintered lap shear joint, isothermal low cycle mechanical fatigue test was conducted in a systematic manner over a wide range of temperatures (25 to 325°C) with the shear strain amplitude set at different values. The low cycle fatigue behavior of the sintered lap shear joint was found to be strongly dependent on test temperature. To...
Fatigue - one of the major mechanical failure, has caught more and more attention in vehicle reliability study. Fatigue test results of vehicles are usually discrete, which is caused mostly by the user's conditions. It is considered the user's real purpose in the test, which can help the users to develop or design a suitable testing program, improve the test run quality and shorten the product development...
The obstacles measurement and recognition from the complex background is the first step for a power transmission line inspection robot to negotiate obstacles autonomously with high reliability. This paper introduces the research and application situations of the inspection robot and analyses the features of the typical obstacles in the real power line. The configuration of control system of the inspection...
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