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A large class of robust electronic systems of the future must be designed to perform correctly despite hardware failures. In contrast, today's mainstream systems typically assume error-free hardware. Classical fault-tolerant computing techniques are too expensive for this purpose. This paper presents an overview of new techniques that can enable a sea change in the design of cost-effective robust...
Long error detection latency, the time elapsed between the occurrence of an error caused by a bug and its manifestation as a system-level failure, is a major challenge in post-silicon validation of robust systems. In this paper, we present a new technique called Quick Error Detection (QED), which transforms existing post-silicon validation tests into new validation tests that significantly reduce...
Robust system design ensures that future systems continue to meet user expectations despite rising levels of underlying disturbances. This paper discusses two essential aspects of robust system design: 1. Effective post-silicon validation, despite staggering complexity of future systems, using a new technique called Instruction Footprint Recording and Analysis (IFRA). 2. Cost-effective design of systems...
IFRA overcomes challenges associated with an expensive step in post-silicon validation of processors - pinpointing the bug location and the instruction sequence that exposes the bug from a system failure. On-chip recorders collect instruction footprints (information about flows of instructions, and what the instructions did as they passed through various design blocks) during the normal operation...
Very thorough online self-test is essential for overcoming major reliability challenges such as early-life failures and transistor aging in advanced technologies. This paper demonstrates the need for operating system (OS) support to efficiently orchestrate online self-test in future robust systems. Experimental data from an actual dual quad-core system demonstrate that, without software support, online...
Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Vias (TSVs) provide a promising area- and power-efficient way to support communication between different stack layers. Unfortunately, low TSV yield significantly impacts design of three-dimensional die stacks with a large number...
Virtualization-assisted concurrent, autonomous self-test, or VAST, enables a multi-/many-core system to test itself, concurrently during normal operation, without any user-visible downtime. Such on-line self-test is required for large-scale robust systems with built-in support for circuit failure prediction, failure detection, diagnosis, and self-healing. The main idea behind VAST is hardware and...
The objective of IFRA, instruction footprint recording and analysis, is to overcome the challenges associated with a very expensive step in post-silicon validation of processors - bug localization in a system setup. IFRA consists of special design and analysis techniques required to bridge a major gap between system-level and circuit-level debug. Special hardware recorders, called footprint recording...
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