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Source/Drain (S/D) engineering in Ge MOSFETs is a complex interplay of various factors, including ion implantation and annealing conditions, electrical activation, the defectiveness of the starting substrate and the contact technology. Some of these aspects will be covered in the following manuscript. It is shown that the formation of highly n-type doped S/D regions suffers from a concentration-enhanced...
We analysed heavily doped p+/n junctions in germanium, and found that the halos in this work provide a tradeoff between transistor channel control and junction leakage. Temperature-dependent leakage measurements show that either trap-assisted tunneling (TAT) or band-to-band-tunneling (BTBT) are the dominant leakage mechanisms for junctions with halos, (junction doping above ~ 1018 cm-3). Further,...
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