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Carbon nanotubes (CNTs) have drawn a lot of attention due to a combination of extraordinary properties and a wide range of potential applications. Due to the large potentials in satisfying future large scale integrated circuit requirements, much effort has been focused on the study of CNTs as on-chip interconnects. Combined with other conventional materials, CNTs are also promising alternatives for...
This paper describes a family of novel dynamically reconfigurable logic gates with double-gate carbon nanotube field-effect transistors (DG-CNTFET). The design is based on a property specific to this device: ambivalence, enabling p-type or n-type behavior depending on the back-gate voltage. Through simulations using available models, these gates and a 10-function ALU offering fine-grain reconfigurability...
Summary form only given. One important function of microsystem packaging is to remove the heat generated by the integrated circuits (ICs). The thermal management of microsystems has now become more crucial as the power density of ICs increases dramatically. To remove the big amount of heat is a big challenge for the packaging technology. An attractive solution is to utilize new developed nanotechnologies...
Since 1991, carbon nanotubes have been considered for successful applications in various fields due to their unique properties. In the present work, carbon nanotubes are applied in integrated circuit packaging, as the bump interconnection for flip chip. The reason for choosing carbon nanotubes as the bump material is their special electrical, mechanical and thermal properties, which may promote both...
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