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The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260degC for 2 minutes. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn2 and finer Cu6 Sn5 particles,...
The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-immersion Au metallization exhibited different interfacial morphology after high temperature storage (HTS) testing at 150degC. Ni3Sn4 intermetallic compounds (IMCs) were found in the Sn-Ag system, while in the Sn-Ag-Cu system, spalling grains of (Cu,Ni)6Sn5 IMC were observed after long aging, along with a thick (Ni,Cu)3Sn4 IMC layer which adheres...
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