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The development of automotive lighting systems with high illumination quality and high reliability is essential for driving safe and comfort. LEDs have many superiorities over the traditional light sources, such as high reliability, good color quality, long lifetime, energy and space saving, environment friendly and so on, when they are operated under an effective health management (such as thermal,...
Recently, with the increasing requirements on guaranteeing the color uniformity and improving the luminous efficacy and manufacturing efficiency, a wafer level chip scale packaging (WLCSP) technology has been developed by thermally impressing a thin multiple phosphor film on a LED wafer, then being segmented into individual LED chips. In this paper, a high power white LED Chip-on-Board (COB) module...
Epoxy mold compound (EMC) and optical grade silicone based materials have been widely used in manufacturing Light Emitting Diode (LED). Silicones are being used as encapsulant and lenses for next-generation LED packaging designs, such as chip on board (COB) LEDs. Silicones serve several roles including protective lenses, stress relieving encapsulant, mechanical protection and light path materials...
Using the analogue of the electric inductance, we reveal the properties of the thermal inductance in GaN-based light-emitting diode devices by testing their transient thermal behaviors. We find that the devices exhibit a transient thermal response under step-down or step-up currents and observe notable inductive phenomena of the temperature response as time evolves from start up to some hundred microseconds...
Today, high-power LED packages have been widely used in many fields by virtue of its high efficiency, long service life and small size etc. A LED package consists of many different components, which are made of different materials being operated under different conditions. As a result, each component has its own pattern of impact on the reliability problem of LED packages, such as chip failure, package...
Compared to traditional silicon based semiconductors, wide band gap semiconductors (e.g. GaN and SiC) have been widely used in high power electronics with their advantages of higher thermal conductivity, higher breakdown field strength, higher operating temperature and lower power loss. The SiC power diode packages, including Schottky Barrier Diode (SBD) and Junction Barrier Schottky (JBS), are usually...
According to the requirements on minimizing the package size, guaranteeing the performance uniformity and improving the manufacturing efficiency in LEDs, a Chip Scale Packaging (CSP) technology has been developed to produce white LED chips by impressing a thin phosphor film on LED blue chips. In this paper, we prepared two types of phosphor-converted white LED CSPs with high color rendering index...
By using a blue light source converted by phosphors to obtain white light emission, phosphor-converted white light emitting diodes (pc-white LEDs) are becoming as one of substitutes of traditional general lighting sources due to their advantages in energy saving, environment-friendliness, color controllability and long lifetime. Within pc-white LEDs, the phosphor films consisting of inorganic phosphor...
The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance...
The 2-stage acceleration theory based accelerated lumen depreciation test method for LED lamps/luminaires was released recently as a standard-CSA020, which can reduce the lifetime test from 6,000 hours to less than 2,000 hours. However, to perform as a methodology in the application of that method, still some concerns existed. This paper validated that methodology by experimentally investigation on...
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