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In this paper, the effects of package level structures and material properties on solder joint reliability subjected to impact loading are investigated by the integrated experimental testing, failure analysis, and finite element modeling. Three different package structures: ball on I/O wafer level package (WLP), copper post WLP, and chip-scale (CS) ball grid array (BGA) package, are studied. Experimental...
In this paper, an integrated testing, finite element modeling and failure analysis approach for drop test reliability of wafer level packages is developed to examine the shock performance of large array wafer level packages. For standard JEDEC drop test, it has been found that corner component group (group A) failed first for 12 times 12 array packages. This is different from previously reported failure...
The demand for wafer level packages (WLP) has increased significantly due to its smaller package size and lower cost. However, board level reliability of WLP is still a major concern. This study investigates the board level temperature cycle reliability of three very different wafer level package configurations. Comprehensive studies are carried out through temperature cycle test, failure analysis,...
Actual field conditions that computer components such as microprocessors experience are different from the accelerated thermal cycling tests typically used to perform reliability assessment. Field conditions can include longer dwell times, different temperature ramp rates driven by power ON/OFF events, and temperature fluctuations during the power ON state due to workload patterns. Series of numerical...
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