The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The bone age of a child indicates the skeletal and biological maturity of an individual. The most commonly applied clinical methods for Bone Age Assessment (BAA) are based on the visual examination of ossification of individual bones in radiographs of the left hand and the wrist by comparing with standard hand atlas. This kind of method is highly subjective and the performance extremely depends on...
An accurate algorithm for 3D rib reconstruction of an individual patient is presented. Segmented ribs are reconstructed in a cylindrical coordinate system, based on available knowledge of human rib geometry. Each rib is reconstructed individually using data from multidetector computed tomography (MDCT) images, which provides geometrical data including unique angle, length, curvature and mass. The...
Realization of 3D IC packaging is mainly depends on the success of fine pitch micro bump bonding process for thin chips stacking and reliability of micro bump interconnections between stacked chips. The uniformity of micro bumps is the critical requirement to achieve good micro bump bonding, and the chip warpage during bonding and underfilling of micro gaps between stacked chips is key challenge in...
In this paper, we focus how to overcome process challenges, such as die shift and warpage, and to fabricate thin embedded wafer level packages (EMWLPs) with 200μm-thick eventually. The initial warpage of reconfigured wafer after post mold curing (PMC) was about 1.0 ∼ 1.4mm range. After PMC, the molded wafer was background to 200μm thickness and redistribution layer (RDL) process was conducted on both...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.