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This paper reports on a minimal growth factor and clinical translation friendly methodology using micromachined penetrating nanoelectrodes to differentiate Adipose Derived Stem Cells (ADSCs) into neuronal lineage. Electrical stimulus is delivered via penetrating nanoelectrodes to differentiate ADSCs toward neuronal lineage with minimal use of conventional growth factors, genetic manipulators, cytokines...
In MEMS realization of high frequency ultrasonic array transducer, electrical impedance matching may become difficult for the reason of the miniaturization of the piezo-array elements. In this study, the electrical impedance of the array elements is estimated first by using KLM model, and then calculated by using finite elements method (FEM), in the case of a LiNbO3 based 30MHz array transducer. The...
In this paper, a TGV interposer based wafer level packaging for inertial MEMS devices is presented. For the TGV interposer, there is a redistribution layer of Al wiring on each side, which are electrically connected with Al metalized TGV. Being as a capping wafer, it's bonded to a MEMS accelerometer wafer based on bulk silicon process with a patterned benzocyclobutene(BCB) layer to achieve wafer level...
In this paper, a novel petaloid hollow Cu interconnection for interposer is presented, its stress can be released by free ends face to hollow Cu interconnection center, and its fabrication process for Si substrate and glass substrate are also presented. Stress distribution and Max. stress of interposer with petaloid hollow Cu interconnection comparison with normal TSV is simulated and analyzed by...
In this paper, a thick TSV interposer with integrated inductor, micro-strip and coplanar waveguides(CPW) transmission lines on high resistivity Si substrate is presented for 2.5 D integration of RF devices. The electrical interconnection through Si interposer is realized by two individual pieces of holly Cu TSVs of different diameters assembled at the axis. Metallization is realized with a redistribution...
Thermal management is a key challenge for TSV (through-silicon-via) enabled integrated three-dimensional microsystem and integrated microchannel cooling is believed as a promising technology because of high inner-chip cooling efficiency. In this paper, a compatible process is presented for integrating microchannel into TSV interposer and three typical types of integrated microchannel are implemented...
In this paper, a novel Si interposer for hermetical MEMS oriented System-in-Package application is presented and it is a low stress, scalable platform with a stress releasing function. It's composed of Si posts which are Air-gapped from Si interposer substituting traditional Copper TSVs to function as electrical interconnection paths, re-distribution layer (RDL) and landing pads for chip stacking...
A fault situation occurs to a service needs to be well analyzed and handled in order to ensure the reliability of composite service. The analysis can be driven by understanding the impact caused by the faulty service on the other services as well as the entire composition. Existing works have given less attention to this issue, in particular, the temporal impact situation caused by the fault. Thus,...
Cloud computing represents a major step up in computing whereby shared computation resources are provided on demand. In such a scenario, applications and data thereof can be hosted by various networked virtual machines (VMs). As applications, especially data-intensive applications, often need to communicate with data frequently, the network I/O performance would affect the overall application performance...
The concept, design and fabrication of L5 photonic crystal nanocavities for stimulated Raman amplification in monolithic silicon is suggested for the first time. Specific ultrahigh Q/Vm nanocavities are presented towards significant on-chip silicon Raman amplification
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