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A new sense amplifier (SA) and relevant circuits were proposed for low-power, high-speed, and small-sized 0.5-V gigabit DRAM arrays. The SA, consisting of a low-VT NMOS preamplifier and a cross-coupled high-VT PMOS latch, achieved 46% area reduction compared to our previously proposed SA with a low-VT CMOS preamplifier. Separation of the SA and a data-line pair, and overdrive of the latch achieved...
We have proposed guiding principle of material selection of electrode/dielectric combination for MIM DRAM capacitors by theoretically taking the tunneling barrier height into account. Accordingly, we found that phase-controlled HfO2 (HfAlO) with TiN electrode is promising. TiN/HfAlO/TiN MIM capacitors with an ultra-thin Al2O3 on the bottom TiN electrode were fabricated and an EOT of 0.7 nm with a...
Microscopical investigation of leakage behaviors of Hf-based high-k gate stacks was achieved by means of electron-beam-induced current (EBIC) method. Carrier separated EBIC measurement has found that in non-stressed samples, hole conduction in pMOS is significantly enhanced by trap-assisted tunneling, while electron conduction in nMOS is independent of traps. The transport mechanisms of electron and...
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