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This paper analyzes the effect of driver size and number of shells on propagation delay for Multi-Walled Carbon Nanotubes (MWCNT) interconnect at 22nm technology node. An equivalent circuit model of MWCNT is used for estimation and analysis of propagation delay. The delay through MWCNT and Cu interconnects are compared for various driver sizes and number of MWCNT shells. The SPICE simulation results...
Electronic equipment with sealed enclosures are used in many applications where ruggedness and harsh environment are governing factors. However, the reliability of such equipment will depend on the effective heat rejection capability. Thus, an optimized thermal design is of paramount importance. In the present paper, thermal analysis of a sealed electronic rack is described. Finite Element code NISA...
An analysis of the influence of tube diameter on single-walled nanotube (SWCNT) bundle interconnect delay is presented. The analysis shows that due to low resistance and inductance SWCNT-bundle interconnect is of lower delay than copper interconnect. Delay increases with increase in tube diameter of SWCNT. It is desirable to restrict tube diameter to the minimum possible.
Wireless sensor networks (WSNs) have recently emerged as a key sensing technology with diverse civilian and military applications. In these networks, a large number of small sensors or nodes perform distributed sensing of a target field. Each node is capable of sensing events of interest within its sensing range and communicating with neighboring nodes. The target field is said to be k-covered if...
This paper addresses power dissipation in single walled carbon nanotube bundle interconnect for VLSI applications at 22 nm technology node. SPICE simulation shows that due to high capacitance, SWCNT-bundle interconnect is of higher power dissipation than copper interconnect. Power dissipation decreases with increase in tube diameter of the constituent SWCNTs. CNT interconnect resistance and inductance...
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