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Germanium-on-silicon is a promising platform for planar photonics over the entire mid-infrared range. We report here grating coupled Ge-on-Si waveguides with record low losses of 0.6dB/cm, multimode interferometers and Mach-Zehnder interferometers.
A novel packaging approach has been demonstrated for circuits connected with flexible microsprings. The approach is based on silicon micromachined features and results in a highly accurate and low cost packaging solution. The micromachined features were processed into silicon with an anisotropic wet etch forming inverted pyramidal micro-pits. The pits are integrated into the chips along with arrays...
The Epitaxy Wrap-through (EpiWT) cell concept is introduced. It combines the benefits of rear-side contacting with the low-cost potential of epitaxial crystalline silicon thin-film technology. Its advantage over the standard EWT cell upon which it is based is the simplified rear structuring due to the inactive substrate. This paper focuses on the development of the key process: the epitaxial deposition...
A new wafer-level method has been developed for localized heating of the bond region between two wafers. Using this method, one of the two wafers to be bonded is heated from the backside, and the other is cooled from the backside, so that heat flows through the bond regions while the device regions stay relatively cool. In this work, integrated temperature sensors were used to measure the temperature...
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