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Low current and high current ESD characteristics of the Poly-Bounded and High-k Metal Gate-bounded ESD diodes with varying stress components are studied in 32 nm SOI technology. It is observed that embedded SiGe (e-SiGe) stress on the anode degrades the ESD protection performance significantly mainly due to the introduction of defects in the active region. Compressive stress liners, tensile stress...
S-parameter test structures from a 45 nm SOI CMOS technology show total capacitance per perimeter of poly-bounded ESD diodes ranges from ~0.35-0.42 fF/mum, and silicide-block (SBLK) bounded diodes show ~15-20% capacitance reduction. Floating-body or notched-silicon tied-body Gate-Silicided GGNMOS devices show total capacitance per width of ~0.65 fF/um for thin oxide devices, and ~0.72 fF/mum for thick...
S-parameter test structures show total capacitances per perimeter of ESD diodes increased from ~0.42fF/mum in 90nm technologies to ~0.7fF/mum in 65nm and 45nm technologies. To achieve lower capacitances for high frequency circuits, layout and process optimization are needed. SCR devices from a 45nm technology show ~0.32fF/mum and can be used for circuit applications with stringent capacitance requirement...
It is crucial to minimize the parasitic capacitance at a high-frequency I/O, found in applications such as high-speed serial links and radio receivers. Here, we study the bias-dependent capacitance of a poly-defined SOI diode-a popular ESD protection device according to C. Putnam et al. (2004), C. Entringer et al. (2005), M. Khazbinisky et al. (2005), S. Mitra et al. (2005), and S. Voidman et al....
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