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The integrated fan-out (InFO) wafer-level chip-scale package (WLCSP) is an emerging packaging technology, which typically consists of multiple redistribution layers (RDLs) for signal redistributions among multiple chips. There is still no published work specifically on the RDL routing for the InFO WLCSP. Published RDL routing works consider different types of routing, namely free-assignment, pre-assignment,...
A placer without considering modern technology and region constraints could generate solutions with irresolvable detailed-routing violations or even illegal solutions. This paper presents a high-quality placement algorithm to satisfy technology and region constraints and optimize detailed-routing routability with three major techniques: (1) a clustering algorithm followed by two-round quadratic placement...
Aiming at the problem of ZigBee tree routing algorithm in which the solution may not be optimal and some nodes may exhaust the energy as a result of heavy transmissions, an optimized ZigBee tree routing algorithm based on the energy-balance. The optimized algorithm imports neighbor-table and the depth of nodes to make sure the routing local optimal in routing hops. This paper also considers the residual...
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