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Extracting similar datapath bit slices which handle highly parallel bit operations can help a modern placer to obtain better solutions for datapath-oriented designs. A current state-of-the-art datapath bit slicing method achieves the best extraction results using a network-flow-based algorithm. However, this work has two major drawbacks: (1) it extracts only a limited number of bit slices for datapaths...
The integrated fan-out (InFO) wafer-level chip-scale package (WLCSP) is an emerging packaging technology, which typically consists of multiple redistribution layers (RDLs) for signal redistributions among multiple chips. There is still no published work specifically on the RDL routing for the InFO WLCSP. Published RDL routing works consider different types of routing, namely free-assignment, pre-assignment,...
A placer without considering modern technology and region constraints could generate solutions with irresolvable detailed-routing violations or even illegal solutions. This paper presents a high-quality placement algorithm to satisfy technology and region constraints and optimize detailed-routing routability with three major techniques: (1) a clustering algorithm followed by two-round quadratic placement...
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