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ldquoSystem-in-Packagerdquo is a key concept to achieve minimum size and costs in hybrid integration. We investigated several related technologies for inertial sensor MEMS packaging, with special emphasis on vacuum packaging of resonant devices like gyroscopes: Hermetic Chip-to-Wafer and Wafer-to-Wafer bonding, Through-Silicon Via in thick and in thin wafers, thin-film getter deposition and fine patterning,...
Smart inertial sensor systems, e.g. gyroscope clusters, are basically formed by a MEMS device with micromachined structures and an ASIC with drive- and sense-circuits. Integration is moving towards a direct interconnect by chip stacking to form a chip-scale system in a package. As an alternative to a Wafer-to-Wafer bonding approach, a Chip-to-Wafer (C2W) assembly can reduce initial product launch...
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