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A novel silicon interposer (SilP) BGA package (PKG) - SilP PKG - has been developed and qualified through test chip. It features three key process technologies; Cu-filled through Si via (TSV), fine pitch multi-layer wiring with Cu- plating, and micro-bump interconnect. The cost-conscious fabrication process flow has been developed based on the build-up print boards' Cu-plating technology and Si wafer...
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