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The dielectric degradation under electrical stress application was attributed to generation of oxygen vacancy, and structural transformation in HfSiON films, in addition to widely known charge trapping. The former two result from ion drift under electrical field due to its ionic character of Hf-based dielectrics. While Vo generation and charge trapping are atomic-range phenomena, it is surprising...
We studied the impact of Yttrium and Lanthanum incorporation into HfO2 on reliability (TDDB, PBTI and 1/f noise). They introduce smaller Weibull ?? values and early failure in TDDB, with negative shift in PBTI. They are caused by the negatively charged interstitial oxygen defect generated by Yttrium and Lanthanum incorporation. The effect of Lanthanum is larger than that of Yttrium. It can be explained...
We report dynamic and microscopic investigations of electrical stress induced defects in a high-k/metal gate stack by electron beam induced current (EBIC). The correlation between dielectric breakdown and EBIC sites are reported. A systematic study was performed on pre-existing and electrical stress induced defects. These defects are successfully visualized. The origin of pre-existing defects is discussed,...
We have clarified the impact on reliability of La incorporation into the HfSiON gate dielectrics nMOSFETs (PBTI, TDDB). Although La incorporation is effective for pre-existing defect suppression, stress induced defect generation is more sensitive to stress voltage and temperature. This is caused by the elevation of the energy level of oxygen vacancy and high ionicity of La-O bond. The origin of defects...
A laminate design technology of metal gates is proposed to improve FET characteristics regardless of EOT and gate dielectric material. The laminated metal gate structures are basically composed of low-Rs(sheet resistance) metal/ WF(work-function)-lowering layer/ WFM(WF determining metal). A thin WFM (~2 nm) laminated by the Si-based WF-lowering layer such as poly-Si or TaSiN brings an additional benefit...
We clarified the impact of the fifth material incorporation into HfSiON technology for Vth control on the reliability of high-k/metal gate stacks CMOSFETs. HfMgSiON is remarkably effective for suppressing electron traps, giving rise to a dramatic PBTI lifetime improvement for nMOSFETs. With pMOSFETs, Al incorporation is effective for the thermal deactivation of hole traps, resulting in NBTI lifetime...
This study aims to investigate the application of a technique to separate bulk hole trap effects from interface state degradation in NBTI to understand hole traps behavior including MOSFET fabrication process dependence. A gate last process is used to fabricate the pMOSFETs with HfSiON/TiN gate stacks. Results show that RTA is an effective method for reducing pre-existing hole traps, while nitridation...
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