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A physical and electro-thermal Compact model for thermal effect and crosstalk in 3D RRAM arrays has been firstly proposed. The simulation results show that the transient thermal effect will dominate reset process. The proposed model is based on 3D Fourier heat flow equation and electro-thermal analogy which can couple thermal network to its electrical schematic. The comparison between the Compact...
This paper presents a 3D circuit model capable of rapidly and accurately evaluating substrate noise coupling in the context of 3D integration. Since TSVs are large and noisy structures, the evaluation of electromagnetic coupling to and from TSVs has become crucial to the design of threedimensional integrated circuits. In this work, we present a fast and accurate 3D circuit model to this end. The model...
Based on three-dimensional (3D) Fourier heat flow equation and numerical simulation, we investigated thermal crosstalk of resistive switching memory in 3D crossbar structure for the first time. Our results show that the transient thermal effect will dominate reset process. With the decrease of RS device size, the thermal crosstalk would remarkably deteriorate the retention of RS memory device and...
3D technologies provide promising solutions to meet the needs of today's high performance and high speed ICs. Therefore, a methodology is required to model, predict, and optimize the 3D interconnect performance. This paper focuses on modeling of the performance of 3D interconnect test structures, realized on Si substrates, both in the time frequency domains. In particular, the impact of the Si substrate...
To estimate the impact of metal-voiding on the frequency-dependent transmission line parameters of the CMOS interconnection, lumped elements have been introduced to the numerical technique. Alternating-direction implicit (ADI) and pseudo-spectral time-domain (PSTD) methods is combined, together with the lumped elements. A three-dimensional ADI-PSTD scheme is adopted to describe the circuit passive...
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