Search results for: Feng Pan
Journal of Alloys and Compounds > 2018 > 740 > C > 222-228
IEEE Electron Device Letters > 2012 > 33 > 12 > 1711 - 1713
Journal of Alloys and Compounds > 2018 > 740 > C > 222-228
IEEE Electron Device Letters > 2012 > 33 > 12 > 1711 - 1713