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In this paper we studied capturing buried void defects in copper (Cu) wires using an electron beam inspection (EBI) system. These are defects of interest (DOI) to integrated circuit (IC) manufacturers because typical defect inspection techniques cannot capture them: optical defect inspection, EBI voltage contrast (VC) mode, and EBI physical detection mode. We used an engineering system to study a...
Advanced bright field (BF) inspector have many functions to increase the defect signal, and suppress the background noise. However, it will take much time to fine tune an optimized BF inspection recipe. The aim of this paper is to propose a faster way to select the optimized optics.
Advanced high performance dark field (DF) inspection is usually utilized at larger defects and the excursions in etch, chemical mechanical polish (CMP) or film deposition processes inspection at high production throughputs. Here demonstrates risky scratch defects right after post poly-silicon CMP captured by DF inspection technique.
Advanced bright field (BF) inspection tool bundles with many powerful features to improve its resolution and sensitivity. However, it usually takes much time for creating an effective monitoring recipe for suppressing the background signal. This paper demonstrates the benefit of BF dark mode inspection for suppressing the interferences of nuisance and pre-layer.
Various three-dimensional (3D) multilayer stacks NAND flash architectures are developed by several companies, the defect performance monitoring under such complicated architectures has become a new challenge in 3D NAND flash. The aim of this paper is to illustrate e beam inspection system can monitor the tiny, invisible defects and electrical defects that can not be recognized by optical systems.
• Review/Inspector Cycle Optimization Methodology : □ Integrate the parameters of the inspection machine and review images at the same time. Nuisance rate is reduced significantly, and therefore the sensitivity and productivity of inspectors and review tools are also improved. • Suppress the Bright Field Inspection Nuisance Rate: □ Base on the reviewed patch images information and feasible threshold...
• Inspecting the wafer edge issue: Wafer bevel inspection can help us to find out the root cause of yield loss from wafer edge or partial die. • Monitoring EBR/ 193 lithography performance : From the EBR monitoring results, bevel inspection find out the top EBR recipe setting is not good, and it also demonstrates the EBR performance with different bevel rinse RPM setting, it can help us to find out...
• Key Technology for Invisible Defects Detection: Electron beam inspection (EBI) system using the Leap & Scan mode with external electric field is a key technology for root cause analysis of invisible defects. • Issues in Continuous Inspection Mode : Continuous inspection mode suffers serious misalignment and low voltage contrast issues, it is hard to inspect the irregularly periphery area. •...
• Advanced Bright Field Inspection Tools: Advanced bright field Inspection tools can provide better WPH, less time to setup recipes, higher sensitivities benefits. However, metal grains suppression still a big challenge for inspection. • Metal Grain Suppression : Series methodologies for suppressing metal grain are demonstrated, it indicated that metal grains suppression can not fulfill by single...
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