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Theoretical calculation and simulation of FEM were proposed to explain the decline of change in resistance in Cu-Sn microbumps during the electromigration test. The IMC transformation from Cu6Sn5 to Cu3Sn was supposed to be the reason. Being aware that the dimension keeps shrinking, the behavior for various solder diameters was also investigated.
A three-dimensional multi-cell model based on a prototypical, planar solid oxide fuel cell (pSOFC) stack design using compliant mica-based seal gaskets was constructed in this study to perform comprehensive thermal stress analyses by using a commercial finite element analysis (FEA) code. Effects of the applied assembly load on the thermal stress distribution in the given integrated pSOFC stack with...
The aim of this study is, by using finite element analysis (FEA), to characterize the thermal stress distribution in a planar solid oxide fuel cell (SOFC) stack during various stages. The temperature profiles generated by an integrated thermo-electrochemical model were applied to calculate the thermal stress distributions in a multiple-cell SOFC stack by using a three-dimensional (3D) FEA model. The...
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