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In this paper, a flexible approach for chip to wafer high-accurate alignment and bonding is developed using a self-assembled monolayer (SAM). In this approach, a hydrophobic SAM, FDTS , is successfully patterned by lift-off process on an oxidized silicon wafer to define the binding-sites. A certain volume of ...
A hydrophobic self-assembled monolayer (SAM) was applied for high-efficient chip to wafer self-alignment and bonding with reasonable high alignment speed (in millisecond) and high accuracy (≤ 1µm). Hydrophilic frame at the edge of each binding-site was demonstrated effective for a successful self-alignment, while superfine pattern at the center was used to control the bonding strength. The effects...
This paper presents our recent progress on a flexible and size-free MEMS-IC integration process for MEMS ubiquitous applications in wireless sensor network (WSN). In our proposal, MEMS and IC known-good-dies (KGD) are temporarily bonded onto carrier wafer with rapid and high-accurate self-alignment by using hydrophobic surface assembled monolayer (SAM) fine pattern and capillary force of H2O; and...
A low-temperature bonding process for packaging surface acoustic wave (SAW) and lead zirconate titanate (PZT) microdevices was developed by the surface activated bonding (SAB) method from room temperature to 100°C. An intermediate gold layer was used in the bonding. The required bonding pressure was optimized. To compare this method with conventional thermocompression bonding and thermosonic bonding...
The bonding possibility of gold layers was investigated at 25~200degC in wafer scale using a surface activated bonding (SAB) method. The interconnections of Si-to-Si and Si-to-PZT substrates were confirmed using different thickness of gold layers. The influence of surface roughness, vacuum condition, wafer temperature and rolling was studied. The bonded samples were observed using a scan acoustic...
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