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For the electronic industry, it is very important to fabricate high quality conductive circuits. At present, the most used photolithography technology involves many steps such as etching, electroplating, and etc, that it is time consuming and high cost. So it is necessary to development much low cost and easy operation processing techniques to resolve the problems. Among them, the screen printing...
In this article, conductive nickel patterns were constructed on flexible substrates via selectively electroless deposition method, which including four procedures, namely KH550-modification, Ni2+ adsorption, selective Ni0-seeding and Ni-lines deposition. Herein, we use KH550 as a bridge for the catalyst and the surface of substrates, and Ni0 as catalyst to replace the traditional Pd catalyst. In this...
The continuing miniaturization and increasing power density of modern electronics make thermal-management a critical challenge for advanced materials used in electronic packaging field. As an important element of electronic packages, the thermal-conduction property of substrates plays an important role in heat removal. Polymer composites are commonly used in substrates because of their ease of large...
Flexible electronics has emerged as an independent field and matured over the past decades due to they can provide a lot of benefits as compared with traditional rigid printed circuit boards, such as better durability, lighter weight, higher space efficiency, and improved comfort. Graphene-based electronics provide new opportunities for flexible electronics because of their superior properties including...
The application of flexible pressure sensors is gradually extended to electronic skins, wearable sensing devices, and humanoid robotics, which are the key to realize artificial intelligence that can contact with humans directly, and to the biomedical applications such as smart prosthesis. In the aforementioned advanced applications, high sensing capability, fast response, high working stability are...
Through silicon vias (TSV) are the enablingcomponents in the emerging 2.5D and 3D integrationmicroelectronic packaging. The insulation layer, i.e. the liner, plays the key role in determining the performance of TSV. Polymer liner are receiving a growing attention for its moresuitable properties and simpler processing compared to thetradition silicon dioxide (SiO2) liner. Recently we reported anovel...
This work describes an electrical conductive composite based on copper nanowires (CuNWs) and flexible polydimethylsiloxane (PDMS) substrate. The CuNWs with average diameter and length of ∼150 nm and ∼20 μm were fabricated by a simple hydrothermal method. There is a face centered cubic (fcc) crystal structure of the as-prepared CuNWs confirmed by X-ray diffraction (XRD) data. The CuNWs were well dispersed...
In this paper, a flexible supercapacitor electrode with high electrochemical performance was fabricated via a electroless plating-electrodeposition combined method which was facile and efficient. The low-cost and available cellulose paper (CP) was employed as flexible substrate loaded highly conductive current collect materials and electrochemical active materials. Results indicate that the as-fabricated...
Elastic conductive composites have exciting applications in modern flexible electronic devices, such as wearable displays, sensors, actuators and stretchable solar cells. Here we present a simple, low-cost and eco-friendly method for preparation of printable and stretchable elastic conductive composites with high conductivity of 4.12 × 104 S/m. The elastic conductive composites were readily fabricated...
This paper presents three related planar EBG (electromagnetic bandgap) structures based on embedded capacitors and inductors, which have small-footprints and can be used in package power or ground planes to provide wideband isolation among different parts of the power distribution network (PDN). Measurement shows −40dB isolation from 2–2.5GHz to over 10GHz. In order to improve performance at lower...
Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30...
With the increasing needs for higher functionality and higher performance of electronic devices, the packaging technology is developing toward functionalization of the inner space of printed-wiring-boards (PWBs) by embedding active or passive components. As a passive component, embedded capacitors have been actively investigated, because they occupy about 40% amount of surface area on a substrate...
It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told, the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20 wt.%) ETFR material that we have researched are introduced, the...
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