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We have successfully fabricated InGaAs-OI tri-gate nMOSFETs, for the first time. The devices were depletion-type (p-n junction-less) nFETs with Fin-channel width (Wfin) down to 20 nm and had metal source/drain structures. It was experimentally demonstrated that Wfin scaling effectively improved cut-off properties at Nd up to 5 × 1018 cm−3 and the electron mobility in the narrowest channel (Wfin =...
High-k/Ge with strontium germanide interlayer has been applied for both p- and n-MISFETs. The observed Jg-EOT trend in the Ge-MISCAPs exhibits comparable or superior leakage characteristics to that of state-of-the-art HfSiON gate dielectrics on Si down to an EOT of 0.96nm. The drive current of the p-MISFETs increases with the EOT scaling around 1nm without μeff degradation. Furthermore, reasonable...
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