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About 1100 ATLAS bare modules will be assembled at Fraunhofer IZM. The bumping and assembly technology of these multichip-modules is described in this paper. Pixel contacts and lead–tin interconnection bumps are deposited by electroplating. A high yield manufacturing technology requires electrical test and optical inspection on wafer level as well as on chip level. In this paper, the result of optical...
Packaging of semiconductor detector modules has been one of the most promising research projects at Fraunhofer IZM. The applications vary from X-ray detection for medical diagnostics to particle detection for fundamental physical research. Starting from feasibility studies a high yield manufacturing process has been established. In this paper the bumping and assembly technology of pixel detector modules...
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