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Wire bonding has been the dominant mode of chip to substrate interconnection for many decades. The most common metal used has been gold which is rather malleable and very resistant to oxidation and corrosion. The surge in commodity prices over the last few years has prompted the introduction of copper as a lower cost alternative. While copper has some advantages electrically, thermally and mechanically,...
Wire bonding has been the dominant mode of chip to substrate interconnection for many decades. The most common metal used has been gold which is rather malleable and very resistant to oxidation and corrosion. The surge in commodity prices over the last few years has prompted the introduction of copper as a lower cost alternative. While copper has some advantages electrically, thermally and mechanically,...
Fine pitch gold wire bonding is the pre-eminent technology for die interconnection and has been advanced to very fine wire diameters. Copper wire bonding has been used for many years as well but was relegated to large wire diameters in automotive and power applications. The surge in gold commodity prices to more than 1,000 USD has fueled great interest in converting fine wire packaging from gold to...
Laminate based substrates have traditionally been of two or more layers of metal because thin Cu clad laminate cores (CCL) have not been available, nor was the equipment/process technology available to circuitize these CCLs. Concomitantly, the designs on both die and substrate level have always assumed the multi-layer nature of the substrate which allowed for wire crossings by using plated through...
Fine pitch Cu wire bonding is at the cusp of becoming main stream. Many challenges had to be overcome when making the transition from fine pitch Au wire bonding to fine pitch Cu wire bonding in a high volume manufacturing environment. The challenges for Cu wire bonding arise from the inherent properties of Cu: propensity to oxidize, increased hardness, slow intermetallic growth whilst dice are (still)...
This paper demonstrates two major works, experimentally determines the material properties and accurately predicts the dynamic response of stressed region on the bond pad and beneath the contact area. The characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer...
In the present paper, the characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer during wire bonding process has been predicted by using finite element method. Material property for Cu wire from mechanical tensile test has shown much more rigid than Au wire...
In the present paper, the tensile mechanical properties of thin gold wire before/after electric flame-off (EFO) process have been investigated by self-design pull test fixture. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also carefully investigated. The accurate experimental material data should be reflected as input for precise finite element analysis. Numerical...
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