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This paper is emphasized on the compression behavior of Sn-3Ag-0.5Cu (SAC305) and Sn-37Pb at elevated temperatures. The effect of temperature for Sn-3Ag-0.5Cu (SAC305) and Sn-37Pb alloys was also discussed. The Quasi-static compression test was also conducted by using the SHIMAZDU AG-X material testing machine and the loading rare was chosen to be 1.67×10-3 s-1 and 1.67×10-4 s-1. Moreover, heating...
This study evaluated room temperature creep properties of the intermetallic compounds (IMCs) formed at the interfaces between Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the commonly used electronic substrates (Cu, Ni and Ag) using nanoindentation. The creep stress exponent (CSE), representing creep resistance, in the decreasing order was Cu, Ni and then Ag based IMCs, which was in good agreement with...
This study investigates the effect of alloying additives on the solidification behavior and microstructural characteristics from a metallurgical perspective. Results show that alloying of Mn and Ti resulted in dramatically reduced undercooling coarse eutectic structure and extended volume fraction of proeutectic Sn of which the dendritic size was refined. Those thermal and microstructural changes...
In addition to a reduced Ag content, it has been demonstrated that significant improvement of drop test performance of Sn-Ag-Cu solder joints can be achieved by alloying with Mn and Ti. This study aims to investigate the effects of Mn and Ti additives on the microstructure and solidification behavior of Sn-1.0Ag-0.5Cu alloys, as well as mechanical properties and thus to explain how the alloying elements...
In this work, we present ball impact test (BIT) results conducted at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu- 0.05Ge package-level solder joints, bonded on substrate pads of immersion tin (IT) and direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported.
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around the intermetallics, similar to that from a board-level drop test. In this paper, both board-level drop test and package-level ball impact test are examined numerically for solder joints of nine Sn-Ag-Cu solder compositions...
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