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Organic laminate substrate is one of the largest constituent volume-wise in area array packages, and it plays a key role in overall package stress and warpage evolutions during fabrication process and in service conditions. In order to accurately estimate the influences of substrate on stress and warpage, it is important to characterize the time-dependent constitutive behavior of the organic substrate...
In this paper a novel simulation procedure combining die-level vibration analysis and transient simulation of free air ball (FAB) and multi-layer pad structure subjected to impact and ultrasonic load from capillary are developed. In transient wire bonding simulation, substrate, dies and die adhesive of package are modeled using support springs in which the corresponding spring coefficients represented...
A reliable and accurate analytical model is desired for the printed circuit board (PCB) with IC package to predict the system response due to loadings such as shock and vibration simulation or even with thermal effect. This work addresses the procedure of model verification by the adoption of experimental modal analysis (EMA) to validate the finite element (FE) model constructed by FE commercial software...
The printed circuit board (PCB) subject to vibration and thermal couple loading is of great interest. This work presents both theoretical analysis and experimental verification for the PCB in heating condition subject to random vibration. The designed heating pad is used as the heating source attached to the package on PCB by providing constant temperature inputs. The calibrated finite element model...
This work presents experimental and molecular dynamics approaches towards deformation and phase transformation mechanisms of monocrystalline Si(100) subjected to nanoindentation. The nanoindentation experiment was conducted with a Berkovich indenter. Following the analysis using cross-sectional transmission electron microscopy with the samples prepared by focused ion beam milling, upon pressure release,...
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