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A reliable and accurate analytical model is desired for the printed circuit board (PCB) with IC package to predict the system response due to loadings such as shock and vibration simulation or even with thermal effect. This work addresses the procedure of model verification by the adoption of experimental modal analysis (EMA) to validate the finite element (FE) model constructed by FE commercial software...
The printed circuit board (PCB) subject to vibration and thermal couple loading is of great interest. This work presents both theoretical analysis and experimental verification for the PCB in heating condition subject to random vibration. The designed heating pad is used as the heating source attached to the package on PCB by providing constant temperature inputs. The calibrated finite element model...
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