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Fine pitch gold wire bonding is the pre-eminent technology for die interconnection and has been advanced to very fine wire diameters. Copper wire bonding has been used for many years as well but was relegated to large wire diameters in automotive and power applications. The surge in gold commodity prices to more than 1,000 USD has fueled great interest in converting fine wire packaging from gold to...
Fine pitch Cu wire bonding is at the cusp of becoming main stream. Many challenges had to be overcome when making the transition from fine pitch Au wire bonding to fine pitch Cu wire bonding in a high volume manufacturing environment. The challenges for Cu wire bonding arise from the inherent properties of Cu: propensity to oxidize, increased hardness, slow intermetallic growth whilst dice are (still)...
From the available mass production devices of HFCBGAs, there can be a range of surface roughness with different surface finished of silicon dies and heat spreader. An aluminum filled gel is used to examine the surfaces clamping with both identical substrates at both sides whether compatible to the thermal conduction. Their thermal contact resistances are measured by laser flash technology and therefore...
Observations from assorted current stressing experiments on flip-chip solder joints imply that the Cu content in a solder joint system plays a dominant role in its electromigration reliability. In this paper, electromigration reliability of various flip-chip solder joint systems including different substrate pad finishes and solder compositions is summarized to demonstrate the effect of the Cu content...
The Cu pillar is a thick under bump metallurgy (UBM) structure developed based on the consideration of alleviating current crowding in a flip-chip solder joint in operation conditions. We present in this work electromigration reliability and morphologies of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated Cu at ~62 mum onto Cu substrate pad metallization through...
In the present paper, the tensile mechanical properties of thin gold wire before/after electric flame-off process have been investigated by self-design pull test fixture. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also studied. The accurate experimental material data should be reflected as input for precise finite element analysis. Numerical model based...
Experimental and numerical studies were conducted to investigate Cu/low-k delamination potentials of a flip-chip package assembly implemented with different underfills under an accelerated thermal cycling test condition. A total of six underfills were considered and compared. Their temperature-dependent Young's moduli, coefficients of thermal expansion, and glass transition temperatures were measured...
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