The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper presents a study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions of drop impact on a portable electronic product. Two test methods are used in this study: board-level drop/shock test (BLDT) and component-level ball impact test (BIT). The performance of 12 material combinations consisting of 6 solder alloys and 2 pad finishes were...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around the intermetallics, similar to that from a board-level drop test. In this paper, both board-level drop test and package-level ball impact test are examined numerically for solder joints of nine Sn-Ag-Cu solder compositions...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around intermetallics, similar to that from a board-level drop test. We investigate numerically in this paper the effect of yield stress variations of solder alloy on transient structural responses of a single package-level solder...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.