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With the further development and utilization of space resource, space communications nowadays are increasingly becoming irreplaceable networking technologies for highresolution earth observation, satellite navigation and deep space exploration where big data is produced. This has created great challenges in ensuring the security and reliability of some sensitive data. In order to solve some problems...
To stack more NAND memory dice in a package or to reduce package thickness, die thickness has to be thinner and thinner. This paper discusses the significant challenges associated with thin die in assembly process and device level reliability. A single die NAND memory ball grid array package was assembled with 4 different die thicknesses as a test vehicle to go through assembly process, temperature...
In the view of the large scale and increasing kinds of service of space information networks, a service- oriented topology control algorithm is proposed. According to demands of existing service, the topology of network is divided into several logical sub-topologies, on which construct the corresponding topology. Taking the communication pattern as an example, the augmentation-based approach is adopted...
In this paper, we examine the merit of a simple and lightweight stochastic transmission strategy based on the ALOHA protocol for underwater wireless sensor networks (UWSNs). We use a stochastic scheduling approach in which time is slotted, and each network component transmits according to some probability during each slot. We present objective functions for assigning the transmission probabilities...
Along with electronic products developing toward lighter, thinner, and multi-functional integration, chip scale package (CSP) has been widely used in electronic packages. Wafer level packaging (WLP) has become one dominant technology. However, applications of WLP are limited by solder joint fatigue due to stress generated by the CTE mismatch among different materials. Compliant wafer level packaging...
In this paper, the backward compatibility solder joints were chosen in simulation of perimeter PBGA272 assembly. A double-symmetric plane FE model of a PBGA272 was established using the software ANSYS. Based on the maximum von Mises stress and von Mises strain, the position of the most danger solder joints were obtained under thermal cycle with the temperature condition from -40degC to 125degC (JESD22-A104-B...
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