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Thermal management for package assembly, especially for high power packages, is very important to the reliability and quality of electrical products. In this paper, a finite element approach is proposed to investigate the thermal performance of TO252-5L(B) package attached on printed circuit board(PCB) with different layers and sizes, which is further related to reliability issue of this type of IC...
Interfacial delamination between molding compound (MC) and die pad interface is the most crucial failure mechanism of exposed pad package under reliability testing due to high interfacial stress and weak adhesion strength. A combined interfacial adhesion characterization, JEDEC Moisture Sensitivity Level 3 and 3X IR reflows qualification and testing, finite element analysis as well as finite element...
Warpage, high stress in dies and solder joints are introduced in assembly process of a package-on-package component. In this paper, a finite element approach is proposed to predict the warpages and stresses during the full assembly process. By the techniques of element die and birth as well as restart method, the approach is able to transfer the stress and warpage in one process to the next so that...
In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used...
In package-on-package (PoP) manufacturing, warpages on both top and bottom packages are concerned. Excess warpage causes solder joint opening, and results in the electrical connection failure of the assembled module. Many parameters of materials, geometry, and process contribute to the warpage of the package. The objective of this paper is to investigate effects of these parameters on the warpage...
Deformation measurement of solder joints under various loadings such thermal and drop/impact is important in reliability design of electronic packages. It is difficult to use traditional techniques such as strain gage method to measure the strain of solder joints because of their small sizes. Instead, the digital image correlation method (DICM) is applied to catch the deformation of the solder joints...
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