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Quad Flat non-lead (QFN) packages known with many outstanding properties. However the thermal stresses and plastic strain accumulation in solder joints during temperature and power cycling can be induced due to the significant mismatch in the coefficients of thermal expansion (CTE) of dissimilar materials. The damage caused by these stresses and plastic strain accumulation, which are induced during...
Thermal management for package assembly, especially for high power packages, is very important to the reliability and quality of electrical products. In this paper, a finite element approach is proposed to investigate the thermal performance of TO252-5L(B) package attached on printed circuit board(PCB) with different layers and sizes, which is further related to reliability issue of this type of IC...
The reliability of novel Quad Flat No-Lead (QFN) package design with multi-row lead fingers has not been well analyzed yet. The thermal characterization, warpage performance and board level solder joint reliability of dual-row and conventional QFN packages are investigated in this paper for comparison. Flotherm Computational Fluid Dynamics (CFD) software is employed to predict the package thermal...
In this study, the board level solder joint reliability analysis and fatigue life prediction of dual-row QFN package are carried out. The effects of solder constitutive model and finite element (FE) model on solder fatigue life are studied. Three different constitutive models of SnAgCu lead-free solder including viscoplastic Anand model, steady-state creep hyperbolic sine model and double power law...
Interfacial delamination between molding compound (MC) and die pad interface is the most crucial failure mechanism of exposed pad package under reliability testing due to high interfacial stress and weak adhesion strength. A combined interfacial adhesion characterization, JEDEC Moisture Sensitivity Level 3 and 3X IR reflows qualification and testing, finite element analysis as well as finite element...
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