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Advanced Satcom Satellites require uplink (30 GHz) and downlink (20 GHz) antennas providing regional earth coverage (Canada, CONUS, Alaska, Hawaii and Puerto Rico) using high gain multiple overlapping spot beams. The antenna coverage with 128 beams that are arranged in a hexagonal grid fashion is shown in Figure 1. Critical antenna design parameters required for this system are very low scan loss...
Two embedded micro-wafer-level packages (EMWLP) with 1) laterally placed and 2) vertically stacked thin dies are designed and developed. Three-dimensional stacking of thin dies is demonstrated as progressive miniaturization driver for multi-chip EMWLP. Both the developed packages have dimensions of 10 mm × 10 mm × 0.4 mm and solder ball pitch of 0.4 mm. As part of the development several key processes...
This paper presents the evaluation results of low temperature cure dielectrics in terms of process ability, adhesion to Si, SiN, Cu RDL and mold compound substrates. Minimum via opening of 10 μm without residue was achieved for 5 μm dielectric film thickness. Adhesion tests results were conducted based on JEDEC standards for MSL1 and unbiased HAST testing and they demonstrated that the low temperature...
The optimization of the temporary wafer bonding process for thin wafers handling is reported. Two temporary bonding materials are evaluated with two low temperature cure (200degC) dielectrics. TGA results show that the dielectric materials are more stable at high temperature (260degC) with not more than 1% weight loss while the temporary bonding adhesives gave a higher weigh loss of 5.5%. It is found...
High permittivity dielectrics ceramics are often used for commercial multilayer ceramic capacitors, actuators applications, and is highly promising materials for dynamic random access memory (DRAM) and microelectromechanical systems (MEMS) applications due to its very stable, high insulating characteristic against voltage. Many studies have been conducted to enhance the above mentioned properties...
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