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Nanotwinned Cu thin films were fabricated on Si (100) substrate by using unbalanced magnetron sputtering (UBMS) system with deposition rate of 0.6 nm/s and 1.4 nm/s, respectively. The effect of film thickness and Ti interlayer on microstructure, resistivity and hardness of the films was investigated. The results show that (111) is the dominant preferred orientation in the Cu films for different thickness...
Nanotwinned Cu thin films were fabricated on Si (100) substrate by using unbalanced magnetron sputtering (UBMS) system. By varying the deposition rate and the deposition temperature, we observed that there are two major twin orientations. One is parallel to the substrate and the other one makes an angel of 70 degree with the substrate. The effect of twin orientation on the mechanical properties and...
Composite flip chip solder joints and composite solder wire samples were used to study thermomigration. The composite solder joint consists of 95Pb5Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Composite wire samples were made by joining Cu (wire) - 95Pb5Sn (ball) - eutectic 37Pb63Sn solder (ball) - Cu (wire) together with the size of the wire and ball of 300 mum in diameter. We have...
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