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This paper presents a monolithic three axial electrochemical micro seismic sensor. In response to the vibration along different axes, the outputs of four sensing units are different and through the decoupling of the differences between them formed by different vibration, the vibration along a certain axis can be detected from the mixed one. Because of the decoupling sensing mechanism with four sensing...
Hermeticity is an important reliability issue for MEMS thin film packages, but difficult to test due to their small volume. We have developed a novel method based on the thin film damping theory to measure the internal pressure and the leak rate of a MEMS thin-film package. The method uses the Focused Ion Beam (FIB) and Laser Doppler Vibrometer (LDV) to monitor the change of the package resonance...
MEMs typically have moving parts that are sensitive to the environmental pressure during operation. Many types of microsystem devices need vacuum in order to operate properly. However, making a high vacuum MEMS package, which maintains this vacuum over a long time, is difficult. Sources of gas inside a MEMS package are mainly due to external leakage or in-diffusion and/or internal materials outgassing...
Three different measurement methods for the measurement of the pressure inside empty MEMS packages are demonstrated and discussed. They are based on measurements of capacitance, cap resonance or cap buckling. The capacitance measurement method is shown to be the most sensitive of the three methods for this application, with a pressure resolution of 11mbar.
We present a MEMS-based approach to AC differential scanning calorimetry (DSC) of biomolecules. Based on a MEMS device that integrates microfluidic handling with highly sensitive thermoelectric detection as well as on-chip AC heating and temperature sensing, we perform DSC measurements under temperature modulation. For the first time, this allows MEMS-based AC-DSC detection of liquid biological samples,...
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