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The mechanical and microstructural change of Ag NPB with ENIG finished Cu and bare Cu were investigated. The results of shear test of NPB with ENIG finished Cu and bare Cu substrates show 25.7 and 26.6 MPa. The effect of surface finish became significant with increasing of aging time. In case of bare Cu substrate, the shear strength gradually decreased with increasing of thermal storage time, and...
Ag nanoparticle sintering has received much attention as an alternative joining method to lead-based soldering for high temperature electronic applications. However, there are still certain issues with this method, such as difficulties of in controlling the joining layer thickness and the occurrence of unexpected voids resulting from solvent evaporation. In this study, the effect of bonding temperature...
As the establishment of high-temperature lead-free solders and other interconnection technologies is an urgent priority in the electronics industry, a strong drive exists to find Pb-free alternatives for high-temperature bonding processes. We propose a no-solvent, no-flux solid-state bonding technique that uses a nanoporous sheet, a process we call nanoporous bonding (NPB). Nanoporous sheets can be...
This research focuses on the formation and growth behavior of Cu/Al intermetallic compounds (IMCs). In order to investigate IMC growth after 30, 60 and 120 min of aging at 270, 300 and 330 °C, cross-section of Al, Cu and Cu/Al IMCs were examined by scanning electron microscopy (SEM). The results showed that the consumption of the Al layer is more rapid than that of Cu layer, and that after 120 min...
Nowadays, silver nanoparticle paste has a great attention as a substitution for lead-based high temperature die-attach material due to its superior thermal conductivity, mechanical properties and high melting point. There are many reports on the Ag nanoparticle sintering using unique properties of nanoparticles related with high surface energy. But there are still some concerns about unexpected voids...
The future electronics will be flexible, bendable, and wearable device. The damages like thermal stress and warpage occurred generally during bonding process between flexible substrate and chip used Pb-free solder for wearable electronic device. Though the wearable electronic devices have been researched, there is few study on bonding technology and reliability of joint between chip with solder bump...
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