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A simulated interconnect/contact/cathode/cathode support test cell is fabricated to investigate the effectiveness of the high‐entropy alloy as the contact material on the microstructure and the performance of the converted spinel‐based layer. Although the CuMnNiFeCo alloy powder is selected as the contact precursor, it showed good sinterability after sintering at 900°C for 2 h in air. The electrical...