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An efficient C2C/C2W oxide bonding technique using self-alignment effect of a pair of hydrophilic chip surfaces, which are activated by atmospheric plasma, is applied to 3D stacking of multichip package in this work. Self-alignment and pre-bonding technique can provide high-speed bonding process and high-precision chip alignment accuracy simultaneously without high-precision chip manipulator. Conventional...
Demand for high speed, high density, small size, and multifunctional electronic devices has driven the development of 3D integration. Cu pillar bumps have received great attentions in ultra fine pitch 3D packaging. In this study, Sn-3.5Ag and Sn-58Bi cap bumps were fabricated on Cu pillar for fine pitch bonding of 3D packaging. Sn-Ag and Sn-Bi cap bumps with eutectic composition were fabricated with...
An efficient C2C/C2W oxide bonding technique using self-alignment effect of a pair of hydrophilic chip surfaces, which are activated by plasma, is applied to 3D stacking of multichip packaging in this work. Self-alignment and pre-bonding technique can provide high-speed bonding process and high-precision chip alignment accuracy simultaneously without high-precision chip manipulator. Through experiments,...
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