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Since starting production with Copper wire bonding for almost a decade, there are still many findings in order to achieve the most stringent quality requirements. Furthermore, some older machine platforms were also converted to Copper wire bonding in order to increase production capacity. In the cases of running extremely sensitive devices, there were many occurrences of lifted bond and pad peel defects...
With the Copper wire bonding already occupying majority of production lines, there are many significant factors continue to surface out. The Copper wire bonding has also becomes very susceptible to production variability of small leaded packages such as Thin Small Outline Package (TSOP). The TSOP utilizes thin and flimsy leadframes, causing a lot challenges at 2nd bond (stitch). The stitch bonding...
Being one of highest growth packages, QFN (Quad Flat No-lead) always facing a lot of challenges in maintaining high equipment efficiency in production mode. A lot of hypothesis was made on the root causes, and mostly blaming on frequent machine change-over or device conversion. This seems to be difficult to fix, simply due to the fact that QFN needs to maintain high flexibility in production. A comprehensive...
Moving towards next level of major cost saving in small outline packages, conversion from gold wire to copper wire became necessary action. With normal production expectations of fast bonding and good quality performance on flimsy leadframe, copper wire challenges of small outline packages were incredible. Furthermore, situation became worse when new copper wire process was found requiring additional...
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