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3D stacking and computational imaging are two major driving forces for CMOS image sensors. In addition, 3D stacking separates pixel array and peripheral circuits. As such, computational imaging blocks (stereo vision, array camera, reconfigurable instruction cell array, etc.) can integrate with sensor circuits while leveraging advanced CMOS technologies including FinFET. To accommodate this trend,...
A 1.1 um pitch pixel array fabricated by 45 nm 3D stacked technology, can be switched to peripheral circuits on same wafer or to other stacked wafer for process and signal integrity verification. It supports through silicon connection or direct connection to increase the flexibility by separating pixel array and sensing circuit. The novel wide operation range VCO and low power serializer are implemented...
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