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A failure analysis of a product due to the on chip ESD structure defects is presented in this paper. ESD is one of the most important reliability issues in the design of integrated circuits. About 40% of the failure of integrated circuits is related to ESD/EOS stress. In order to improve the reliability of ICs, the design of ESD protection is increasingly necessary for the modern semiconductor industry...
Decoupling for power rails that demand large current, such as FPGA core, is difficult. The capacitors required for derived solution requires excessive board area for placement and raise system cost significantly. Switcher with high loop Band Width helps reducing the decoupling needs with all the design improvements. In this paper, we proposed a 3-stage behavioral model for switcher to help PCB designer...
In this paper a potential based model for monocrystalline silicon thin film transistor (TFT) systems on glass (SOG) substrate from the accumulation to the strong-inversion region is developed. By solving the complete dimensional (1D) Poisson's equation, the potential distribution in the channel is obtained. The analytic drain current is expressed accurately base on the potential solution. Compared...
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