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Cu wire bonding is one of the hottest trends in electronic packaging due to the cost and the electrical and thermal performance advantages of Cu wire over Au wire. However, there are many challenges to Cu wire bonding, one of which is the increased stress transmitted to the bond pad during ball bonding process. This high stress is not desirable as it leads to pad damage or cratering in the silicon...
A real-time in situ ball bond stress signal is recorded without destructing the sample, using a piezoresistive integrated CMOS microsensor located next to a test pad on a testchip. The sensor is sensitive to in-plane shear stress tauxy that arises due to changes of the principal stress components at the test pad. Without the ball bond, the signal remains almost unchanged during 400 h high temperature...
Strong crescent bond and strong tail bond are crucial for maintaining reliability and bondability of the wire bond and stability of the bonding process, respectively. This study investigates the optimization of tail breaking force and pull force of the crescent bond with insulated X-WireTM. The pull force and the tail breaking force are individually optimized by an iteration method. The results are...
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