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2.5D and 3D Integration technology using temporary bonding has become main stream in the semiconductor industry in recent years. However, thermal stability, low damage, and debonding at comparative low temperature are still areas of challenge. In this present study, a novel three-dimensional crosslinked polyurethane (3DPU) based on thermal reversible Diels-Alder chemistry, which can be used as temporary...
The toxicity of many heavy metals in plants is closely associated with its subcellular distribution and chemical forms. The subcellular distribution and chemical forms of cobalt (Co2+) were investigated using 3 barley genotypes differing in Co2+ toxicity resistance, namely Yan66 (resistant), Ea 52 (sensitive), and Humai 4 (moderate), under two Co2+ levels (25 and 100 µM). Higher Co2+ level in cultural...
In this paper, the stretchable conductors were fabricated by in-situ polymerization of 3,4-ethylenedioxythiophene (EDOT) on polyurethane sponges (PUS). The mechanical property, electrical conductivity, resistance variation and cycling stability of poly(3,4-ethylenedioxythiophene) (PEDOT) based PUS (PUS-PEDOT) stretchable conductors were investigated. It was found that the stretchable conductors can...
In this paper, the three-dimensional compressible graphene foam was synthesized via a simply reduction and self-assembly process. The as-prepared three-dimensional graphene foam shows ultralow density, high porosity and great mechanical compressibility and stability. With unique electrical feature and high sensitivity as well as robust mechanical strength, the as-fabricated three-dimensional graphene...
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