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Reported herein is a comprehensive and comparative study on NMOSFETs with HfLaSiON and HfLaON gate dielectric with an equivalent oxide thickness (EOT) of 0.9 nm (Tinv~1.2 nm). Digital and analog performances as well as reliability characteristics are compared in detail. It is shown that HfLaSiON has a strong relationship with the interface characteristics due to low barrier height, while HfLaON with...
Sample devices were fabricated with 2.0 nm SiO2 and 2.5-10.0 nm HfO2. Transistor transconductance and gate leakage were used to evaluate PID. BTI and dielectric breakdown were measured to study the PID effect. For both nMOSFETs and pMOSFETs, the transconductance was degraded for the different antenna structures. It was found that, even below 0.9 nm of EOT range, the plasma charging damage was observed...
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