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Three‐dimensional (3D) flexible electronics represent an emerging area of intensive attention in recent years, owing to their broad‐ranging applications in wearable electronics, flexible robots, tissue/cell scaffolds, among others. The widely adopted 3D conductive mesostructures in the functional device systems would inevitably undergo repetitive out‐of‐plane compressions during practical operations,...
Fatigue Life
In article number 2102684, Yihui Zhang and co‐workers present an antifatigue strategy to prolong the fatigue life of 3D ribbon‐shaped electronics by switching the metal‐dominated failure to polymer‐dominated. Combined measurements and computations allow establishment of a failure criterion capable of predicting fatigue life under compressions, thereby providing useful guidelines for the...
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